Events SIAM Conference on Mathematics of Data Science (MDS20)

Talk Videos from SIAM Conference on Mathematics of Data Science (MDS20)

May 4, 2020. Online

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35Speakers

22Talks

2000Attendees

17Hours of content

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About the Event

Topic: Artificial Intelligence and Machine Learning

This conference provide a forum to present work that advances mathematical, statistical, and computational methods in the context of data and information sciences and aims to unite researchers who are building mathematical foundations for data science and making principled applications to science, engineering, technology, and society.

#big data #data science #data-driven modeling #deep learning #ds #dynamical systems #machine learning #method of moments #statistics #topological image analysis

Yacoub Kureh

PHD Candidate at University of California, Los Angeles

I completed my PhD in Mathematics at UCLA in 2020. My research interests lie in Network Science and Machine Learning.

I wear many hats. I will always consider myself a student as my curiosities are never sated. I enjoy programming and teaching. I've been in numerous leadership roles and have an affinity for working in groups. I constantly search for efficient and creative solutions to all kinds of problems.

I am also involved in social activism in a number of spaces. Evidence and argumentation are my guides to life.

Vito Dai

Director of Engineering at Motivo

Luigi Capodieci

CTO at Motivo

Electronic and Semiconductor Industry expert in the field of Design For Manufacturability and IC CAD.

Prior Positions:

+ President and Chief Technologist at KnotPrime

+ Design Enablement Fellow at GLOBALFOUNDRIES

+ Director of DFM/CAD and Engineering R&D Fellow at GLOBALFOUNDRIES (www.globalfoundries.com), coordinating DFM R&D from 45 and 32/28nm, down to the next generations of 20 and 14nm technology nodes.

+ R&D Fellow at AMD, focusing on advanced Resolution Enhancement Technologies (RET), Optical Proximity Correction (OPC) and Design For Manufacturability (DFM) for 45 nm, 32 nm and 22 nm Technology Nodes.

Technical Areas: Physical design implementation and verification, lithography simulation and process modeling, CAD and electronic design automation (EDA).